IC CHIP BGA REBALLING STENCIL KITS SET SOLDER MSM8917 MSM8937 BG161 BG221 IN PAKISTAN (SB9)
IC CHIP BGA REBALLING STENCIL KITS SET SOLDER MSM8917 MSM8937 BG161 BG221 IN PAKISTAN (SB9)
BGA Reballing Stencil Kit for Repairing Phones (MSM8917, MSM8937, BG161, BG221)
Is your phone experiencing glitches, freezing, or not turning on? It could be a problem with the connections on the motherboard. Albarak Mobile offers the IC Chip BGA Reballing Stencil Kit, a valuable tool for technicians to repair these issues in specific phone models.
What is BGA Reballing and Why Use a Stencil Kit?
BGA Reballing is an advanced repair technique for phones. Tiny solder balls connect important chips, like processors, to the main circuit board. If these balls get damaged, the chips can malfunction, causing various problems on your phone.
A BGA Reballing Stencil Kit includes tools to replace the damaged solder balls with new ones. The stencil acts as a guide during this process, ensuring precise placement of the new solder balls for a successful repair.
Who is This BGA Reballing Kit For?
This BGA Reballing Stencil Kit is designed for experienced phone repair technicians who have the skills and equipment for intricate repairs like reballing. It's not recommended for DIY phone repairs.
What's Included in the BGA Reballing Stencil Kit (MSM8917, MSM8937, BG161, BG221)?
- High-Precision Reballing Stencil: This stencil ensures accurate placement of solder balls on specific phone models compatible with processors like MSM8917, MSM8937, BG161, and BG221 (Please check compatibility with your phone model before purchasing).
- Solder Materials (Optional): Some kits may include solder paste or other materials needed for reballing. Please check the specific product description.
Why Choose the BGA Reballing Stencil Kit from Albarak Mobile?
- Compatible with Specific Processors: This stencil works with the layout of certain phone models containing processors like MSM8917, MSM8937, BG161, and BG221 (Double-check compatibility before buying).
- Durable Material: The stencil is made from high-quality material for long-lasting use.
- Precise Cutouts: Ensures accurate solder ball placement for successful reballing.
- Complete Kit (Optional): Some kits may include all the necessary materials for reballing (check product description).
We Recommend Professional Repair Services
BGA Reballing is a complex phone repair process. If you suspect your phone needs reballing, we highly recommend seeking professional help from a qualified technician. Improper repairs can further damage your phone.
Albarak Mobile offers expert phone repair services, including reballing for various phone models. Contact us today for a free quote!
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